MediaTek has expanded its mobile chipset with the launch of the Dimensity 1050. The main feature of the Dimensity 1050 is that it is the company’s first chipset to offer mmWave and 6 GHz sub-6G dual-band connectivity. But other than that, it’s just a lower spec version of the current Dimensity 1100 SoC.
MediaTek Dimension 1050: Specifications
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Built on a 6nm class process, the MediaTek 1050 features an octa-core setup, utilizing an Arm Cortex-A78 performance core clocked at 2.5GHz. MediaTek’s press material doesn’t say anything about efficiency cores, but it’s safe to assume that the chipset uses Arm Cortex-A55 cores. Arm Mali-G610 is responsible for rendering games and graphics, the HyperEngine 5.0 suite from MediaTek provides additional optimization tools and features to improve gaming performance.
The chipset supports Full HD + displays with a refresh rate of up to 144Hz. In addition, support for hardware-accelerated AV1 video decoding and playback of HDR10+ and Dolby Vision is also available.
The MediaTek Dimensity 1050 is the company’s first chipset to support seamless connectivity between mmWave and sub-6 GHz 5G. This means that OEMs will not have to choose between supporting mmWave or sub-6GHs; They can have the best of both worlds with Dimensity 1050.
The chipset also offers 3CC carrier aggregation on the sub-6 GHz (FR1) spectrum and 4CC carrier aggregation on the mmWave (FR2) spectrum, delivering transfer speeds up to 53% faster compared to LTE+ mmWave aggregation. The MediaTek 1050 also supports a Wi-Fi 6E antenna and 2×2 MIMO for ultra-fast Wi-Fi connectivity.
The first smartphones powered by the MediaTek Dimensity 1050 are expected to arrive in the third quarter of 2022.
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